Huawei annonce LogicFolding : densité 3D sans machines EUV, 1,4 nm visé pour 2031
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In three linesHuawei unveils LogicFolding, a 3D density technology targeting 1.4 nm by 2031 without EUV equipment dependency. He Tingbo, head of Huawei's semiconductor division, announced it on May 25, 2026 at IEEE ISCAS conference in Shanghai.Read source
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